4,4'-Bis(4-aminophenoxy)biphenyl (BAPB) CAS 13080-85-8

Synonyms: 4,4′-(1,1′-Biphenyl-4,4′-diyldioxy)dianiline; Benzenamine, 4,4′-[[1,1′-biphenyl]-4,4′-diylbis(oxy)]bis-; 4-{[4′-(4-aminophenoxy)[1,1′-biphenyl]-4-yl]oxy}phenylamine; 4,4'-[Biphenyl-4,4'-diylbis(oxy)]dianiline;

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Product Details

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4,4'-Bis(4-aminophenoxy)biphenyl (BAPB), CAS 13080-85-8, is an aromatic diamine monomer with flexible ether linkages and a rigid biphenyl core, enabling the synthesis of high-performance polymers like polyimides with enhanced thermal stability, mechanical flexibility, biocompatibility, and proton conductivity.

Basic Information of BAPB

Product Name	4,4'-Bis(4-aminophenoxy)biphenyl
Abbreviation	BAPB
CAS Number	13080-85-8
Molecular Formula	C24H20N2O2
Molecular Weight	368.43 g/mol
Appearance	White to gray to red powder to crystal
Purity	≥99%
Package	1kg/bottle, 20kg/drum, or customized
Molecular formula

Key Properties

Rigid biphenyl ether backbone yields high mechanical strength
Good thermal stability, high melting point, suitable for high-temperature polymer systems
Flexible ether linkage improves processability compared to fully rigid structures
Dual amine groups allow polymer chain extension or crosslinking
Used in aerogels and covalent organic frameworks (COFs) applications owing to structural properties

Key Applications of BAPB

High-Performance Polymers: Serves as a monomer for polyimides, poly(ether ether ketone amide)s (PEEKAs), and copolymers, offering high glass transition temperatures (190–220°C) and thermal decomposition above 500°C, ideal for aerospace composites, structural materials, and heat-resistant resins.

Electronics and Electrical Insulation: Incorporated into polyimides for flexible copper clad laminates (FCCL), semiconductor sheets, and low-dielectric insulators (Dk ~2.9, Df ~0.0044), used in microelectronics, 5G devices, and data centers.

Aerospace and Automotive: Utilized in high heat-resistant plastics and adhesives with excellent toughness and dielectric properties, suitable for aircraft parts, automotive components, and environments requiring durability under thermal stress.

Coatings and Adhesives: Acts as a curing agent in epoxy resins and polyurethane coatings, providing improved flexibility, toughness, and high lap-shear strengths (>6000 psi), for protective surfaces and structural bonding.

Advanced Materials: Employed in composite materials with nanofillers for enhanced mechanical properties, and explored for gas separation membranes, piezoelectric sensors, and potential biomedical uses like drug delivery due to biocompatibility

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