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1,3-Bis(3-aminophenoxy)benzene (APB) CAS 10526-07-5

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1,3-Bis(3-aminophenoxy)benzene (APB) CAS 10526-07-5

Synonyms: Resorcinol Bis(3-aminophenyl) Ether; 3,3'-[1,3-phenylenebis(oxy)]bis(benzenamine); 3,3'-[m-Phenylenebis(oxy)]dianiline; 3,3'-Phenylenedioxydianiline; 1,3-Bis(m-aminophenoxy)benzene; 1,3,3-APB; 3-[3-(3-aminophenoxy)phenoxy]aniline

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Product Details

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1,3-Bis(3-aminophenoxy)benzene (APB), CAS 10526-07-5, is an aromatic diamine monomer with flexible ether linkages, used primarily in synthesizing high-performance polymers with enhanced thermal stability, mechanical strength, and processability.

Basic Information of APB

Product Name1,3-Bis(3-aminophenoxy)benzene
Abbreviation

APB

CAS Number

10526-07-5

Molecular FormulaC18H16N2O2
Molecular Weight292.33 g/mol
AppearanceWhite to light yellow to light orange powder to crystal
Purity≥99%
Package1kg/bottle, 20kg/drum, or customized
Molecular formulaAPB Molecular Structure

 

Key Properties

  • High-performance polyimide and copolyimide resins

  • Advanced engineering polymers and composite materials

  • Electronics insulating films and microelectronic materials

  • Specialty polymers in aerospace, coatings, adhesives

  • Research & development monomer for novel polymer systems


Key Applications of APB

  • High-Performance Polymers: Serves as a monomer for polyimides, poly(ether ether ketone amide)s (PEEKAs), and copolymers, offering high glass transition temperatures (190–220°C) and thermal decomposition above 500°C, ideal for aerospace composites, structural materials, and heat-resistant resins.

  • Electronics and Electrical Insulation: Incorporated into polyimides for flexible copper clad laminates (FCCL), semiconductor sheets, and low-dielectric insulators (Dk ~2.9, Df ~0.0044), used in microelectronics, 5G devices, and data centers.

  • Aerospace and Automotive: Utilized in high heat-resistant plastics and adhesives with excellent toughness and dielectric properties, suitable for aircraft parts, automotive components, and environments requiring durability under thermal stress.

  • Coatings and Adhesives: Acts as a curing agent in epoxy resins and polyurethane coatings, providing improved flexibility, toughness, and high lap-shear strengths (>6000 psi), for protective surfaces and structural bonding.

  • Advanced Materials: Employed in composite materials with nanofillers for enhanced mechanical properties, and explored for gas separation membranes, piezoelectric sensors, and potential biomedical uses like drug delivery due to biocompatibility


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